Added rules

This commit is contained in:
2025-07-19 10:33:11 +02:00
parent 144c960452
commit b849ee76c5
4 changed files with 4665 additions and 17 deletions

View File

@@ -167,3 +167,42 @@
(constraint silk_clearance (min 0.15mm))
(layer outer)
(condition "A.Type == 'pad' && (B.Type == 'text' || B.Type == 'graphic')"))
(version 1.1)
#----------------------------------------------------------------------------------------------------
# AISLER custom DRC rules.
# Make Hardware less Hard.
#----------------------------------------------------------------------------------------------------
# We created these custom rules to warn you if your design hits our manufacturing bounderies.
# You can disable the custom rules by commenting them out, though we advise against it.
# These rules are valid as of May 2024, please check for updated ones on our forum.
# Please also note that these rules do not catch every single manufacturing limit.
# If you are not certain please check the documentation on our website.
#----------------------------------------------------------------------------------------------------
# As our tooling is finite we only support certain trough hole sizes.
# Please keep the plated trough holes below 5.6mm in diameter.
# We provide a community post for more details:
# https://community.aisler.net/t/plated-and-non-plated-holes/50
(rule "Max Drill Hole Size PTH"
(constraint hole_size (max 5.6mm))
(condition "A.Pad_Type == 'Through-hole'"))
#----------------------------------------------------------------------------------------------------
# We dont support micro or buried vias
(rule "Disallow buried via"
(constraint disallow buried_via))
(rule "Disallow micro via"
(constraint disallow micro_via))
#----------------------------------------------------------------------------------------------------
# The Soldermask is pulled back by a bit to account for slight missalignment during manufacturing.
# We do this on our own, please keep the soldermask margin set to 0.
(rule "Disallow solder mask margin overrides"
(constraint assertion "A.Soldermask_Margin_Override == 0mm")
(condition "A.Type == 'Pad'"))
#----------------------------------------------------------------------------------------------------

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View File

@@ -1,7 +1,7 @@
{
"board": {
"active_layer": 2,
"active_layer_preset": "All Layers",
"active_layer_preset": "",
"auto_track_width": false,
"hidden_netclasses": [],
"hidden_nets": [],
@@ -49,7 +49,7 @@
"conflict_shadows",
"shapes"
],
"visible_layers": "ffffffff_ffffffff_ffffffff_ffffffff",
"visible_layers": "00000000_00000000_00000002_2200888c",
"zone_display_mode": 1
},
"git": {
@@ -87,16 +87,16 @@
9
],
"col_widths": [
0,
0,
0,
0,
0,
0,
0,
0,
0,
0
10,
10,
10,
10,
10,
10,
10,
10,
10,
3021
],
"custom_group_rules": [],
"expanded_rows": [],

View File

@@ -123,20 +123,20 @@
},
"rules": {
"max_error": 0.005,
"min_clearance": 0.0,
"min_clearance": 0.1,
"min_connection": 0.0,
"min_copper_edge_clearance": 0.5,
"min_copper_edge_clearance": 0.2,
"min_groove_width": 0.0,
"min_hole_clearance": 0.25,
"min_hole_to_hole": 0.25,
"min_hole_to_hole": 0.15,
"min_microvia_diameter": 0.2,
"min_microvia_drill": 0.1,
"min_resolved_spokes": 2,
"min_silk_clearance": 0.0,
"min_text_height": 0.8,
"min_text_thickness": 0.08,
"min_through_hole_diameter": 0.3,
"min_track_width": 0.0,
"min_through_hole_diameter": 0.2,
"min_track_width": 0.1,
"min_via_annular_width": 0.1,
"min_via_diameter": 0.5,
"solder_mask_to_copper_clearance": 0.005,